Delft Circuits heads to Denver, Colorado for the APS Summit 2026 (March 16–20) — one of the largest physics gatherings in the world, uniting researchers, engineers, and industry leaders shaping the future of quantum. With a 14-person delegation spanning sales, R&D, product development, and flex foundry engineering, we’re ready to talk I/O at every level.

See our flagship system live
Visit us at booth #1407 to see the 256-channel loader — the highest-density I/O system available on the market. Built with superconducting NbTi flex technology, integrated filtering, and precision-tested in Delft, this system is designed for the next generation of quantum and cryogenic compute.

Meet our experts
Whether you’re scaling a transmon system, exploring spin qubits, or integrating SNSPDs — our team includes the engineers who design, manufacture, and test the systems you’ll rely on. From system architecture to flex foundry capabilities, this is your chance to go deep.

Discover what’s next
Learn about our latest developments in high-density interfacing, newest partnerships, and our roadmap toward 1,024+ channels per loader. We’ll walk you through how Cri/oFlex® fits your cryostat.

Want to schedule a meeting at APS?
Contact us to book a slot with our team in Denver.

Quote:
“APS is where the quantum community comes together. We’re bringing our biggest team yet — because we believe the best I/O conversations happen face to face. Come see how we’re removing the hardware limits.”
— Robby Ferdinandus, CCO